????TI????????×?PowerPAD·?×°??LDO,?????????á.????VIA°???????GND??????

?ü??pad???ó??top layer??6.5mm*3.4mm,pad?????ò8??via??????dia=13mil?????ó??VCC layer???????????????????à??????cadence??pad_designer?±??????????(regular_pad=30mil)

1. ?????????¨??via??VCC layer????????parameters->internal layers?????????????¨????fixed??

2.??via??????vcc layer??thermal??relief??anti??pad???????è??

3.?ò??via??top??gnd???ê???à?????????à?±???????????é???¤·???pad???±???ò?×,?????????è??????pad??°?,?í??thermal??relief???×??×???????°?,????????thermal??relief??anti??pad???????è??

4.bottom layer??????°??????è°?.???ù?è?ê??????????XSection??views????
???è?????é???

5, ???×thermal??relief??anti??pad???¨??????????????°?

1?????????????????ù??VIA??VCC???á×????????????¨?¨??anti-pad)
2.thermal-relief and anti-pad??°?±?regular pad?ó18??mil,
3.via???è??pad,?ò????TOP ??BOTTOM???ü???????????üPIN????
5.thermal-relief????????????????×??????¨?????¨·????????????ì????anti-pad??·??????¨??VIA??????VCC?ò??GND?????±?ò?ú????????????????????